See their past imports from Besi Apac Sdn Bhd, a supplier based in Malaysia. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products. US Customs Records Notifications available for Cobham D/b/a Aeroflex. MULTI-CHIP FOR FLIP CHIP DIE BONDER / FOR DIE-ATTACH DATACON 2200 EVOPLUS thermal die bonder THERMAL DIE BONDER DATACON 2200 EVO HS DIE BONDING epoxy die bonder EPOXY DIE BONDER ESEC 2100 SC epoxy die bonder / for die-attach EPOXY DIE BONDER / FOR DIE. Key Features: Datacon 2200 evo goes hS Enhancements. Onrion LLC will provide you with the best prices, terms and lead times on the USA market.
#Datacon 2200 evo price plus
The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. The Datacon 2200 evo hS die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost of ownership. Knowledgeable with the following machines and equipment: Datacon Welding, SEHO Wave Soldering, Muhlbauer Tape & Reel, Disco Dicing Saw, Fico Lasermark, Trim & Form and Datacon 2200 Evo Die Attach Machines, XYZTec Bond Tester and OGP Smartscope plus the following test methods: X-ray Radiography, Decapsulation, Cross-section, C-mode Scanning.
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